LogicTouch SV TCL Associates Probe Company China Japan Europe

Discussion in 'General' started by eddrdgreen, Oct 15, 2014.

  1. The shrinking of IC die geometries and the growing complexity of device designs are making the task of on-wafer testing increasingly more difficult. SV TCL's LogicTouch is suited perfectly for these types of advanced designs, a fine pitch technology utilizing a MEMS-style probe targeted for pad-limited devices such as High-Volume SoCs, Microcontrollers, DSPs and 3D Packages. LogicTouch is also ideal for the latest device applications including TSV (Through-Silicon Via) and Copper Pillar (Cu-Pillar).
    - Fine Pitch Capability Down to 50µm
    - No Chip Design Limitations
    Probe Arrays
    Corner Pads
    - Single Pin Repairable
    - MEMS-Style Probes
    Greater Scrub Consistency 
    More Dimensional Control
    Contact your SV TCL & Associates Probe Company China Japan Europe Representative so we can help you find the right LogicTouch product for your vertical testing needs.


Share This Page